Wireless Leveling System – Very Flat (WLS2-VF)

Leveling / Inclination / Parallelism

CADwalk integrates synergetic concepts to create necessary functionality at minimized costs and cost of ownership.
We build a dual-axis and one of the
smallest, most useful, time and cost saving wireless-leveling-module for the automation-, semiconductor- and flat-panel-industry.

Semiconductor Special: WLS2-VF

Specifications: WLS2-VF

  • Accuracy: ± 0.08 degrees
  • Repeatability: ± 0.08 degrees
  • Resolution: ± 0.03 degrees
  • Total range: ± 60 degrees
  • Class 1 Radio Module: Bluetooth 4.0
  • Radio frequency:  2.4 to 2.45 GHz
  • Radio max output power:  11 dBm (13 mW)
  • Communication range: 10 m
  • Battery life without recharging: 4.5 h


  • The very thin wireless levelling system can be placed nearly everywhere
  • Save enormous time aligning equipment
  • Increase yield, throughput and MTBF

Key Features:

  • Package: wireless sensor module only 4 mm tall.
  • Keep it flat: can be put into a suitable releasing of a carbon fiber dummy wafer
  • Send tilt Data of two dimensions to a PC or Laptop
  • Visualisation: under Windows 7/8/10/11, intuitive bubble movement in real-time, programmed in LabVIEW™, Data logging


Size: (63x66x4) mm
Weight: 32 g

CADwalk offers wireless acceleration, vibration, and leveling sensor systems. CADwalk also offers semiconductor device simulation as services.