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Automation-, Semiconductor- and Flat-Panel-Market

Wireless Leveling System - Very Flat (WLS2-VF)

Leveling / Inclination / Parallelism

CADwalk integrates synergetic concepts to create necessary functionality at
minimized costs and cost of ownership.
We build a dual-axis and one of the
smallest, most useful, time and cost saving wireless-leveling-module for the
automation-, semiconductor- and flat-panel-industry.
Semiconductor Special: WLS2-VF
Wireless Leveling System Very-Flat

Key Features:

  • Package: wireless sensor module only 4 mm tall.
  • Keep it flat: can be put into a suitable releasing of a carbon fiber dummy wafer
  • Send tilt Data of two dimensions to a PC or Laptop
  • Visualisation: under Windows XP/Vista/7/8/8.1/10, intuitive bubble movement in real-time, programmed in LabVIEW™, Data logging
  • Accuracy: ± 0.08 degrees
  • Repeatability: ± 0.08 degrees
  • Resolution: ± 0.03 degrees
  •  Total range: ± 60 degrees
  •  Class 1 Radio Module: Bluetooth 4.0
  •  Radio frequency:  2.4 to 2.45 GHz
  •  Radio max output power:  11 dBm (13 mW)
  • Communication range: 10 m
  • Battery life without recharging: 4.5 h
  • The very thin wireless levelling system can be placed nearly everywhere
  • Save enormous time aligning equipment
  • Increase yield, throughput and MTBF
Size: (63x66x4)mm
Weight: 32 g